Draft Details

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

Number:prEN IEC 63378-2-2:2026

Committee:CLC/TC 47X

Review end date:10 Apr 2026

This draft is no longer available to be viewed. The comments that have been made on it have been collected, and will be considered by the committee responsible for the draft.