Electronics

prEN ISO 11670 - Lasers and laser-related equipment - Test methods for laser beam parameters - Beam spatial stability (ISO/DIS 11670:2025)
Categories: Optoelectronics. Laser equipment
Committee: CEN/TC 123 (Lasers and photonics)
Origin: CEN
Close date: 04 Jul 2025
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ISO/DIS 11670 - Lasers and laser-related equipment — Test methods for laser beam parameters — Beam spatial stability
Categories: Optoelectronics. Laser equipment
Committee: ISO/TC 172/SC 9 (Laser and electro-optical systems)
Origin: ISO
Close date: 04 Jul 2025
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IEC 62047-52 ED1 - Semiconductor Devices - Micro-electromechanical Devices - Part 52: Biaxial tensile testing method for stretchable MEMS
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 04 Jul 2025
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IEC 62908-12-10 ED3 - Touch and interactive displays - Part 12-10: Measurement methods of touch displays - Touch and electrical performance
Categories: Electronic display devices
Committee: IEC/TC 110 (Electronic displays)
Origin: IEC
Close date: 11 Jul 2025
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prEN ISO 11551 - Optics and photonics - Lasers and laser-related equipment - Test method for absorptance of optical laser components (ISO/DIS 11551:2025)
Categories: Optoelectronics. Laser equipment
Committee: CEN/TC 123 (Lasers and photonics)
Origin: CEN
Close date: 17 Jul 2025
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ISO/DIS 11551 - Optics and photonics — Lasers and laser-related equipment — Test method for absorptance of optical laser components
Categories: Optoelectronics. Laser equipment
Committee: ISO/TC 172/SC 9 (Laser and electro-optical systems)
Origin: ISO
Close date: 17 Jul 2025
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IEC 63068-5 ED1 - Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 5: Test method for defects using X-ray topography
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 18 Jul 2025
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IEC 63378-6 ED1 - Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 18 Jul 2025
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prEN IEC 63378-6:2025 - Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 18 Jul 2025
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prEN IEC 63287-4:2025 - Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 25 Jul 2025
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IEC 63287-4 ED1 - Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 25 Jul 2025
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IEC 62715-6-42 ED1 - Flexible displays - Part 6-42: Flattening force measurement methods for rollable display devices
Categories: Electronic display devices
Committee: IEC/TC 110 (Electronic displays)
Origin: IEC
Close date: 01 Aug 2025
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IEC 63652-2 ED1 - NFC Forum Specifications - Part 2: NFC Data Exchange Format (fast track)
Categories: Electronic display devices
Committee: IEC/TC 100 (Audio, video and multimedia systems and equipment)
Origin: IEC
Close date: 01 Aug 2025
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IEC 63652-1 ED1 - NFC Forum Specifications - Part 1: NFC Wireless Charging (fast track)
Categories: Electronic display devices
Committee: IEC/TC 100 (Audio, video and multimedia systems and equipment)
Origin: IEC
Close date: 01 Aug 2025
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prEN IEC 60297-3-101:2025 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
Categories: Mechanical structures for electronic equipment
Committee: CLC/SR 48D (Mechanical structures for electronic equipment)
Origin: CENELEC
Close date: 08 Aug 2025
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prEN IEC 60297-3-102:2025 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle
Categories: Mechanical structures for electronic equipment
Committee: CLC/SR 48D (Mechanical structures for electronic equipment)
Origin: CENELEC
Close date: 08 Aug 2025
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IEC 60297-3-102 ED2 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle
Categories: Mechanical structures for electronic equipment
Committee: IEC/TC 48 (Electrical connectors and mechanical structures for electrical and electronic equipment)
Origin: IEC
Close date: 08 Aug 2025
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IEC 60297-3-101 ED2 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
Categories: Mechanical structures for electronic equipment
Committee: IEC/TC 48 (Electrical connectors and mechanical structures for electrical and electronic equipment)
Origin: IEC
Close date: 08 Aug 2025
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prEN IEC 61760-4:2025 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Categories: Electronic component assemblies
Committee: CLC/SR 91 (Electronics assembly technology)
Origin: CENELEC
Close date: 22 Aug 2025
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IEC 61760-4 ED2 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Categories: Electronic component assemblies
Committee: IEC/TC 91 (Electronics assembly technology)
Origin: IEC
Close date: 22 Aug 2025
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