Electronics

prEN IEC 60679-2:2025 - Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 2: Guidelines for the use of oscillators
Categories: Piezoelectric devices
Committee: CLC/SR 49 (Piezoelectric and dielectric devices for frequency control and selection)
Origin: CENELEC
Close date: 19 Sep 2025
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IEC 62715-6-22 ED2 - Flexible displays - Part 6-22: Crease and waviness measurement methods for foldable displays
Categories: Electronic display devices
Committee: IEC/TC 110 (Electronic displays)
Origin: IEC
Close date: 03 Oct 2025
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IEC 63145-20-10 ED2 - Eyewear display - Part 20-10: Fundamental measurement methods - Optical properties
Categories: Electronic display devices
Committee: IEC/TC 110 (Electronic displays)
Origin: IEC
Close date: 03 Oct 2025
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EN IEC 61587-1:2022/prA1:2025 - Amendment 1 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects
Categories: Mechanical structures for electronic equipment
Committee: CLC/SR 48D (Mechanical structures for electronic equipment)
Origin: CENELEC
Close date: 10 Oct 2025
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IEC 61587-1/AMD1 ED5 - Amendment 1 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects
Categories: Mechanical structures for electronic equipment
Committee: IEC/TC 48 (Electrical connectors and mechanical structures for electrical and electronic equipment)
Origin: IEC
Close date: 10 Oct 2025
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IEC 60747-5-19 ED1 - Semiconductor devices - Part 5-19: Optoelectronic devices - Light emitting diodes - Test method of the micro photoluminescence for chip wafers of micro light emitting diodes
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 10 Oct 2025
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IEC 62899-402-2 ED2 - Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Categories: Printed circuits and boards
Committee: IEC/TC 119 (Printed Electronics)
Origin: IEC
Close date: 24 Oct 2025
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prEN IEC 61249-2-54:2025 - Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Categories: Printed circuits and boards
Committee: CLC/SR 91 (Electronics assembly technology)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-1:2025 - Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-2:2025 - Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-3:2025 - Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-4:2025 - Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
Draft Details
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IEC 61249-2-54 ED1 - Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Categories: Printed circuits and boards
Committee: IEC/TC 91 (Electronics assembly technology)
Origin: IEC
Close date: 31 Oct 2025
Draft Details
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IEC 63550-3 ED1 - Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
Draft Details
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IEC 63550-4 ED1 - Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
Draft Details
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IEC 63550-1 ED1 - Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
Draft Details
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IEC 63550-2 ED1 - Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
Draft Details
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