Electronics

IEC 62899-402-2 ED2 - Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Categories: Printed circuits and boards
Committee: IEC/TC 119 (Printed Electronics)
Origin: IEC
Close date: 24 Oct 2025
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IEC 61249-2-54 ED1 - Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Categories: Printed circuits and boards
Committee: IEC/TC 91 (Electronics assembly technology)
Origin: IEC
Close date: 31 Oct 2025
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IEC 63550-3 ED1 - Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
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IEC 63550-4 ED1 - Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
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IEC 63550-1 ED1 - Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
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IEC 63550-2 ED1 - Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 31 Oct 2025
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prEN IEC 61249-2-54:2025 - Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Categories: Printed circuits and boards
Committee: CLC/SR 91 (Electronics assembly technology)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-1:2025 - Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-2:2025 - Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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prEN IEC 63550-3:2025 - Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
Draft Details
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prEN IEC 63550-4:2025 - Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in memristor devices
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 31 Oct 2025
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IEC 63378-6-1 ED1 - Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
Categories: Semiconductor devices
Committee: IEC/TC 47 (Semiconductor devices)
Origin: IEC
Close date: 14 Nov 2025
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prEN IEC 63378-6-1:2025 - Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 14 Nov 2025
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prEN IEC 63171-1:2025 - Connectors for electrical and electronic equipment - Part 1: Detail specification for 2-way, shielded or unshielded, free and fixed connectors - Mechanical mating information, pin assignment and additional requirements for Type 1 (copper LC style)
Categories: Electromechanical components. Electronic and telecommunications equipment
Committee: CLC/SR 48B (Electrical connectors)
Origin: CENELEC
Close date: 05 Dec 2025
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