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EN 50110-1:2023/prA1:2026 - Operation of electrical installations - Part 1: General requirements
Categories: Power transmission and distribution networks
Committee: CLC/BTTF 62-3 (Operation of electrical installations)
Origin: CENELEC
Close date: 10 Apr 2026
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IEC 60601-2-92 ED1 - Medical electrical equipment - Part 2-92: Particular requirements for the basic safety and essential performance of magnetic resonance guided radiotherapy equipment for use with external beam equipment
Categories:
Committee: TC 62/SC 62C (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 60761-1 ED3 - Radiation protection instrumentation - Equipment for continuous monitoring of radioactivity in gaseous effluents - Part 1: General requirements
Categories: Radiation protection
Committee: TC 45/SC 45B (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 61850-7-43 ED1 - Communication networks and systems for power utility automation - Part 7-43: Basic communication structure - Compatible logical node classes and data object classes - Primary equipment
Categories: Telecontrol. Telemetering
Committee: TC 57 (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 61850-7-440 ED1 - Communication networks and systems for power utility automation - Part 7-440: Basic communication structure - Compatible logical node classes and data object classes - Power quality metering
Categories: Telecontrol. Telemetering
Committee: TC 57 (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 61850-7-44 ED1 - Communication networks and systems for power utility automation - Part 7-44: Basic communication structure - Compatible logical node classes and data object classes - Instrument transformers
Categories: Telecontrol. Telemetering
Committee: TC 57 (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 61850-7-4 ED3 - Communication networks and systems for power utility automation - Part 7-4: Basic communication structure - Compatible logical node classes and data object classes - Core
Categories: Telecontrol. Telemetering
Committee: TC 57 (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 62047-56 ED1 - Semiconductor devices - Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor
Categories: Semiconductor devices
Committee: TC 47/SC 47F (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 63053-2 ED1 - Residual current operated circuit-breakers for household and similar uses for dc systems - Part 2: Residual current operated circuit breakers without integral overcurrent protection (DC-RCCBs)
Categories: General
Committee: TC 23/SC 23E (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 63378-2-2 ED1 - Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
Categories: Semiconductor devices
Committee: TC 47/SC 47D (error)
Origin: IEC
Close date: 10 Apr 2026
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IEC 63378-4 ED1 - Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
Categories: Semiconductor devices
Committee: TC 47/SC 47D (error)
Origin: IEC
Close date: 10 Apr 2026
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prEN IEC 60601-2-92:2026 - Medical electrical equipment - Part 2-92: Particular requirements for the basic safety and essential performance of magnetic resonance guided radiotherapy equipment for use with external beam equipment
Categories:
Committee: CLC/TC 62 (Electrical equipment in medical practice)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 61850-7-4:2026 - Communication networks and systems for power utility automation - Part 7-4: Basic communication structure - Compatible logical node classes and data object classes
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 61850-7-40:2026 - Communication networks and systems for power utility automation - Part 7-40: Basic communication structure - Compatible logical node classes and data object classes - Common
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
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prEN IEC 61850-7-401:2026 - Communication networks and systems for power utility automation - Part 7-401: Basic communication structure - Compatible logical node classes and data object classes - Protection
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 61850-7-43:2026 - Communication networks and systems for power utility automation - Part 7-43: Basic communication structure - Compatible logical node classes and data object classes - Primary equipment
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 61850-7-44:2026 - Communication networks and systems for power utility automation - Part 7-44: Basic communication structure - Compatible logical node classes and data object classes - Instrument transformers
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 61850-7-440:2026 - Communication networks and systems for power utility automation - Part 7-440: Basic communication structure - Compatible logical node classes and data object classes - Power quality metering
Categories: Telecontrol. Telemetering
Committee: CLC/TC 57 (Power systems management and associated information exchange)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 63053-2:2026 - Residual current operated circuit-breakers for household and similar uses for dc systems - Part 2: Residual current operated circuit breakers without integral overcurrent protection (DC-RCCBs)
Categories: General
Committee: CLC/TC 23E (Circuit breakers and similar devices for household and similar applications)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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prEN IEC 63378-2-2:2026 - Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
Categories: Semiconductor devices
Committee: CLC/TC 47X (error)
Origin: CENELEC
Close date: 10 Apr 2026
Draft Details
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